Solidus Technologies logo

Solidus Technologies

by Solidus Technologies, Inc.
No reviews yet
Active7+ countries
Quick facts
VendorSolidus Technologies, Inc.
Year launchedN/A
StatusActive
Location3333 North El Paso Street, Suite E | Colorado Springs, CO 80907-5478, USA
Countries served7+
Languages1
IntegrationsN/A
Free tierNO
Free trialNO
Contact salesYES

About Solidus Technologies

Solidus Technologies provides MEMS and Mixed Signal ASIC Test Equipment (ATE) and related engineering services. The company offers products for wafer probe testing and package level testing for various sensors and semiconductors.

Solidus Technologies, Inc. is a company specializing in MEMS (Micro-Electro-Mechanical Systems) and Mixed Signal ASIC Test Equipment (ATE). It serves the semiconductor industry, with a particular focus on the automotive sector. The company's main offerings include the STI3000 Wafer Probe Test System and the STI9000 Mixed Signal Tester, designed for both wafer-level and package-level testing of sensors like gyros, accelerometers, and pressure sensors. Solidus Technologies also provides a comprehensive suite of engineering services, covering the entire product development cycle from design and fabrication to characterization and production. The company emphasizes providing high return on investment through its flexible, scalable, and cost-effective testing solutions. Pricing is not publicly available, and interested parties must contact the company for information, including academic pricing.

Pros & Cons

Pros
  • Specializes in MEMS and Mixed Signal ASIC test equipment.
  • Offers a diverse portfolio of both products and engineering services.
  • Provides turnkey solutions and systems integration.
  • Emphasizes cost-effective testing with scalable, open-architecture platforms.
Cons
  • Pricing information is not publicly available and requires direct contact.
  • The company's website appears dated, with a copyright notice from 2008.

Features

Key features

Wafer Probe Testing

Offers the STI3000 system for fully dynamic testing of MEMS sensors like gyros and accelerometers at the wafer level.

Mixed Signal ATE

Provides the STI9000 Mixed Signal Tester for cost-effective package level testing of MEMS and Mixed Signal ASICs.

Drive Sense Technology (DST)

A proprietary technology combining circuitry, software, and test methods for accurate MEMS sensor dynamic behavior analysis.

Engineering Services

Offers a range of services including MEMS sensor element design, test system development, product characterization, and manufacturing services.

Scalable Test Platforms

Features open architecture, flexible, and scalable hardware platforms for testing from wafer to package level.

Additional features

Turnkey Solutions

Provides complete turnkey solutions, systems integration, and ATE systems for semiconductor testing.

Multi-Site Configurations

Supports single-site and multi-site testing configurations.

Configurable Load Boards

Utilizes configurable load boards and STICOMM test modules for flexibility.

Small Footprint Systems

Test systems are designed with a small form-factor to minimize space requirements.

Standard Tool Utilization

Employs robust standard hardware and software tools to lower the cost of testing and maintenance.

Pricing

Free trial
Free version
Request a quote
Promo Offer

Countries & Languages

7
Countries served
1
Interface languages
—
Billing currencies

Available in

United StatesUnited KingdomChinaTaiwanKoreaJapanFrance

Interface languages

English

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